Product Details 商品詳細介紹
♦機台特色♦
- Multi size wafers handling.
- Handling of 25/13 slots wafer cassette.
- Adavanced wafer handling build-in vacuum end effector.
- Advanced robot transfer arm.
- Single taping mode.
- Build in heater chuck table.
- Build in SMART wafer aligner.
- Wafer ID reader (Option).
- SECS/GEM compliance (Option).
- Industrial PC control.
- Heater blade (Option)
- Laser sensors for transparent material (Option)
♦機台優勢♦
- Ultra high UPH taper system.
- Various of tape congifuration setting.
- Cover for different range of wafer thickness (Programmable Z height chuck table)
- 1 click tape changing setting.
- Programmable tape tensioning.
- Bubble free lamination.
- Capable to handle all type of wafer format (Flat / Notch).
- Adjustable mounting pressure to suit various tape manufacturer.
- User friendly UI.
