♦Features♦

1. 12" wafer handling (Optional for 8").

2. Capable to handle FOUP, FOSB and wafer cassette.

3. Detection of wafer protrusion from cassette.

4. Wafer cross slot detection.

5. Wafer at cassette mapping graphic.

6. Bernoulli end effector wafer handling, build in vacuum selection.

7. Advanced 3-axis robot assembly.

8. Intelligence wafer alignment, wafer centering and notch/flat finding.

9. Automatic FOUP door opener.

10. ESD ionizer unit.

11. Recipe wafer control system

12. Handheld barcode reader for lot tracking.

13. PC base software

♦選配♦

Ultra high resolution probe system

1. Equipped with laser hologage
2. Accuracy of 0.15um (in 0 to 35 mm range)
3. Soft touch contact force of 0.01N