Product Details 商品詳細介紹
The system is designed to crush " Scrap Wafer-Die".
Can be integrated the dicing tape/dies separator. (Option)
Custom made cutting tool.
Multiple crushing tool set to make smaller size of scrap.
♦機台特色♦
- Safety feature.
- Clean room specs compliance.
- Low noise.
- Future upgradeable to conveyor system (Option).
- PLC control come with inverter
*Customization / Design to meet customer requirement.