♦機台特色♦

1. Wafer frame size 250mm. 
2. High speed rotary module cater for 4 angle.
3. High speed pick and place arm.
4. Wafer frame precisor module.
5. Cross slot wafer detection.
6. Wafer protrusion detection.
7. Touch screen display.
8. Top side BCR module.
9. Windows PC-based user friendly graphical user interface.
10. Waer soring selection by recipe or operator.
11. Live soring graphical user interface.
12. Up to 400 WPH.

♦Option♦

1. Add in barcode printer.
2. Add in mounting accuracy inspection system.
3. SECS/GEM.
4. Wafer-ID reader for OCR.
5. Dual end effector for maximum throughput.
6. Add in mounting accuracy inspection.
7. Auto recipe slection.
8. UPS (Uninterruptable Power Supply).
9. CDA and N2 pressure indicator.
10. Bottom side OCR module.