Product Details 商品詳細介紹
♦機台特色♦
- Handling of 25/13 slots wafer cassette.
- Advanced wafer handling build-in vacuum.
- Bernoulli end effector (Option).
- Advanced robot transfer arm.
- Wafer mapping.
- Build in heater universal chuck table.
- VDO wafer pre-aligner.
- Motorized tape remover assy.
- LED UV irradiation chamber.
- Rotatable chuck table 5degree.
- Waste tape rewinding system.
- Controllable de-tape speed.
- Universal loadport.
- SECS/GEM compliance (Option).
- Industrial PC control.
