Product Details 商品詳細介紹
♦機台特色♦
- Manual load/unload wafer.
- 8" & 12" porous chuck.
- Wafer frame mounting based.
- Precise vacuum control and detection.
- Programmable chuck table speed.
- Motorized tape remover assy.
- User friendly recipe control software.
- Rotatable chuck table 45degree (Option).
- Waste tape rewinding system.
- Controllable de-tape speed.
- Dual type detapping method (Option).
- SECS/GEM compliance.
- Industrail PC control.
Wafer De-tapping system
- Capable to build-in different type of de-tapper method to fulfill our customer needs.
- Depends on application with tailor made design.
- Up to 50micron wafers de-tapper capability.
- Detection for every de-tapping process.
- Hassle free and eady to maintenance.
♦特色♦
Peeling detection
- Vision sensors to detect tape peel up.
- 100% proven detection for unsuccessful detape.
Customize parameter setting on GUI
- Tape revinder speed.
- Chuck speed min 1mm/sec.
- Chuck temperature setting with live 5 points reading.
- Peeling speed / peeling angle.