◎ The system is designed with DUAL TAPING MODULE capable to handle various BG tape (UV or Non UV).

◎ Thermal Tape and etc. A STAND ALONE solution for backgrind application wafer fromnt side protection.

♦機品特色♦

1. Automatic load/unload wafer.
2. Up to 300mm wafer mounting.
3. FOUP open door 天車
4. Programmable advanced roller tape mounting.
5. Vacuum fork or Bernoulli wafer arm (Option)
6. Advanced wafer alignment.
7. Heated wafer chuck (Option)
8. UV tape capability.
9. Auto liner tape rewinding.
10. Automatic tape cutting
11. Tape spool air lock system.
12. SECS/GEM (Option).
13. Class 100 hepa option.
14. User friendly operation system, parameter setting with recipe control.