♦機台特色♦

1. Air bubble free mounting.
2. Input wafer cassette handling.
3. Coin stacked wafer box handling (Option).
4. Vacuum fork or Bernoulli wafer arm.
5. Vision wafer alignment.
6. UV tage capability.
7. LED-UV irradiation system (Option).
8. BG tape removing / detaper (Option).
9. OCR wafer ID reader (Option).
10. Frame barcode labeling / scanning (Option).
11. Narrow rape (8" wafer frame - 270mm tape width option)

►OPTION : LED-UV irradiation system

a) Uniform LEd UV light source.

b) Wavelength of 365nm.

c) More than 20,000 hours light source life time.

d) No Ozone generated.

e) Much imporvement on adhesive residue.

►OPTION : OCR wafer ID reader (Code, Fonts Wafer ID - OCR, 2D matrix and barcode wafer ID reader)

a) OCR - IBM font, triple font, SEMI font (SEMI M12, M13 & M1.15)

b) 2D date matrix (ECC200, 8x32) - SEMI T7, M1.15

c) Barcode - IBM412 & BC412 (SEMI T1-95)