♦機台特色♦

1. Confiture for 8" & 12" wafer.
2. Manual load/unload wafer to XY stage.
3. Build in motorize XY table.
4. Manual die indexing.
5. Barcode lable scanner.
6. Host interface, upload/download e-Map.
7. Industrail PC control.
8. Camera assy, 5-megapixel high DPI CCD system, 2/3" CCd wafer.
9. Microscope with bright field modules. 5X B, 10X B, 20X B, 50X B.
10. ESD ionizer unit.
11. Theta-axis stage.
12. Equipment anti-vibration unit.
13. Image measurement shown on monitor.
14. Die size, saw width measurement system.
15. Wafer e-Map editing :

         - support e-Map of partial wafer and broken wafer

         - Generic convertor, convert multiple wafer e-Map formats.