Product Details 商品詳細介紹
♦機台特色♦
- Air bubble free mounting.
- Input FOUP / FOSB (Wafer Cassette) handling.
- Coin stacked wafer box handling (Option).
- Vacuum fork or Bernoulli wafer arm (Option).
- Vision wafer alignment.
- UV tape capability.
- Partial wafer mounting capability.
- OCR wafer ID reader (Option).
- Frame barcode labeling / scanning (Option)
- Up to 300mm wafer.
- Narrow tape (8" wafer frame - 270mm tape width).
